400-Gbps/λ Ultrafast Silicon Microring Modulator for Scalable Optical Compute Interconnects
Revolutionizing AI Interconnects with 400-Gbps/λ Silicon MRMs
This analysis highlights a breakthrough in silicon photonics: a novel microring modulator (MRM) achieving record-breaking 400 Gbps/λ data rates and ultra-low energy efficiency. Designed for scalable AI computing and datacenter interconnects, this device addresses critical bandwidth and power consumption challenges with its innovative design and wafer-scale manufacturability.
Executive Impact: Unlocking Next-Gen AI Performance
Key performance indicators demonstrating the transformative potential of ultrafast silicon microring modulators for AI workloads.
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Per-Wavelength Data Rate
First wafer-scale silicon MRM solution achieving this record-high speed, crucial for capacity scaling.
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Energy Efficiency
Demonstrated in self-biasing mode for error-free 32 Gbps NRZ, surpassing copper links.
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Electro-Optic Bandwidth
Achieved at -3V bias, overcoming the traditional bandwidth-efficiency trade-off.
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Wafer-Scale Platform
CMOS-compatible fabrication ensures manufacturability and cost-effectiveness for mass production.
Deep Analysis & Enterprise Applications
Select a topic to dive deeper, then explore the specific findings from the research, rebuilt as interactive, enterprise-focused modules.
Record 400 Gbps/λ Achieved
400 Gbps/λ Breaks previous limitations, enabling unprecedented data throughput per wavelength for AI and datacenter applications.| Feature | Silicon MRM (This Work) | Traditional Electrical / Other Photonic Platforms |
|---|---|---|
| Bandwidth | Up to 400 Gbps/λ (PAM6) | Limited by link length/signal integrity (Electrical); Integration challenges (TFLN/InP) |
| Energy Efficiency | 0.97 fJ/bit (NRZ, self-biasing) | Higher, requires power-hungry drivers/DSP (Traditional Electrical); Varies (Other Photonic) |
| Scalability | CMOS-compatible, wafer-scale, WDM-ready | Limited CMOS compatibility, higher cost (Other Photonic); Scaling challenges (Electrical) |
| Integration | Die-to-die CPO integration, compact footprint | Bulky, pluggable optics (Traditional); Limited integration (TFLN/InP) |
| Operation Modes | Dual (Self-biasing for scale-up, Depletion for scale-out) | Typically single mode (Depletion) |
MRM Dual-Mode Operation for Scalable AI Interconnects
Self-Biasing Mode (Energy-Efficient Scale-up)
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Low Vpp & Zero Bias
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Error-Free 32 Gbps NRZ / 0.97 fJ/bit
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UCIe 2.0 Compliance
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Depletion Driving Mode (Ultrafast Scale-out)
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Higher Vpp & Reverse Bias
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400 Gbps PAM6 / >110 GHz EO Bandwidth
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High-Capacity Ethernet
Wafer-Scale Uniformity & Production Ready
Mass Production Ready Demonstrated consistent performance across 12-inch wafers, enabling commercial-scale deployment for AI infrastructure.Novel Trench-Integrated Doping Structure
The core innovation lies in a narrow trench structure with heavy doping. This design broadens the optical bandwidth by inducing propagation loss (reducing Q-factor) while simultaneously extending electrical bandwidth through reduced series resistance. Heavy doping further boosts modulation efficiency by increasing carrier density, leading to an impressive electro-optic bandwidth exceeding 110 GHz at -3V bias and 80 GHz at 0V bias without optical peaking.
CMOS Compatibility for Advanced Integration
Fabricated on a 300 mm silicon photonic platform using standard foundry processes, this MRM leverages CMOS compatibility for wafer-scale manufacturability. Its compact footprint and low power consumption make it ideal for co-packaged optics (CPO) and die-to-die (D2D) integration, critically addressing the demand for high-bandwidth-density transceivers in next-generation AI computing networks.
Advanced ROI Calculator
Estimate the potential efficiency gains for your enterprise by integrating cutting-edge silicon photonic interconnects. Adjust the parameters below to see the projected annual savings and reclaimed operational hours.
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Your Implementation Roadmap
A phased approach to integrate high-performance optical interconnects into your enterprise infrastructure.
Phase 1: Needs Assessment & Customization
Detailed analysis of your current AI compute infrastructure and data center interconnect needs. Identify specific bottlenecks and tailor the MRM integration strategy.
Phase 2: Prototype Development & Testing
Develop and test a customized silicon photonic prototype with the 400 Gbps/λ MRMs, ensuring seamless integration with existing hardware and software stacks.
Phase 3: Pilot Deployment & Performance Validation
Deploy the MRM-based optical interconnects in a pilot environment, rigorously validating bandwidth, energy efficiency, and scalability under real-world AI workloads.
Phase 4: Full-Scale Integration & Optimization
Roll out the solution across your entire infrastructure, continuously optimizing for peak performance, reliability, and cost-effectiveness. Establish monitoring and maintenance protocols.
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